Can solar cells from end-of-life photovoltaic panels be used to produce composite materials?

The prospect of using recovered solar cells from end-of-life (EoL) photovoltaic panels (PVPs) to produce composite materials with dielectric properties was studied. The main goal of this research was to reduce the waste originating from EoL PVPs by reusing the semiconductor, thus rendering solar energy an even greener energy source.

Does adding solar cell powder increase bending strength of epoxy resin matrices?

Therefore, the calculation of the bending strength, based on the Euler–Bernoulli [ 21] trends, can be considered as an approximation. Thus, it can be concluded that the addition of solar cell powder does not bring about any significant changes in the bending strength of the epoxy resin matrices.

Are photovoltaic panels sustainable?

A significant increase in waste originating from end-of-life photovoltaic panels is expected in the upcoming decades, as the world is turning to renewable energy sources. Therefore, a sustainable management plan for recovering and reusing critical materials in photovoltaic panels becomes imperative.

How are solar cells recovered from EOL PVPS?

Solar cells were recovered from EoL PVPs through thermal treatment to remove polymer sheets and screening to separate the solar cells from glass and electrodes. Composite materials were manufactured by reinforcing two different epoxy resins, Araldite LY556 and Resoltech 1050, with varying concentrations of ground solar cells (0–10% w/w).

Does resoltech resin reinforced with solar cells improve mechanical and dielectric properties?

It was found that the produced composite material resulting from Resoltech resin reinforced with solar cells recovered from EoL PVPs had better mechanical and dielectric properties.

Can epoxy resin encapsulate a PSC device?

In a study, the permeation of moisture into the PSC device has been prevented using a commercialized UV curable epoxy resin (Vitralit) . However, in this work, epoxy resin doesn't act as an encapsulate but acts as a sealant to seal the PSC device on the FTO glass substrate with a cover glass encapsulate.